Memory overheating and thermal pad degradation on RX 6900 XT and 6800 XT
RX 6000-series flagship cards use GDDR6 memory chips distributed across the front of the PCB, with thermal pads transferring heat to both the front heatsink and the rear backplate. These pads, when new, keep junction temperatures within an acceptable range during sustained GPU workloads. After several years of thermal cycling, the pads compress, dry out, and lose their thermal conductivity — causing individual GDDR6 chips to spike in temperature under load. The result is artefacts, screen corruption, driver crashes, or hard system resets that occur specifically during demanding workloads and disappear at idle. A full pad replacement — including the backplate-side pads that many previous repair attempts overlooked — resolves this in the majority of cases.
